Main performance requirements of sputtering targets

Purity of sputtering targets

Purity is one of the main performance indexes of target, because the purity of target material has great influence on the performance of film. However, in practical applications, the purity requirements of target materials are also different.

Impurity content of sputtering targets

The impurities in the solid and the oxygen and water vapor in the pores are the main sources of the deposited films. Different targets have different requirements for different impurity contents. For example, pure aluminium and aluminium alloy targets used in semiconductor industry have special requirements for the content of alkali metals and radioactive elements.

Density of sputtering targets

In order to reduce the porosity in the solid of the target and improve the performance of the sputtered film, it is usually required that the target has a high density. The density of target not only affects the sputtering rate, but also affects the electrical and optical properties of the films. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target will enable the target to better withstand the thermal stress during sputtering. Density is also one of the key performance indicators of targets.

Grain size and grain size distribution of sputtering targets

Usually, the target is polycrystalline structure, and the grain size can be from micron to millimeter. For the same target, the sputtering rate of the target with fine grain is faster than that of the target with coarse grain, and the thickness distribution of the film deposited by the target with small grain size difference (even distribution) is more uniform.

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