What kinds of sputtering processes are there?
Sputtering technology is mainly used in sputtering etching and thin film deposition.
When depositing thin films, the sputtering source is placed at the target pole and sputtered after being bombarded by argon ions. If the target material is a single substance, a single substance film of the target material is formed on the substrate. If the reactive gas is consciously introduced into the sputtering chamber to react with the sputtered target atoms and deposit on the substrate, the compound film of the target material can be formed. Usually, the compound or alloy film is made from the compound or alloy target. It is obtained by direct sputtering.
In sputtering etching, the etched material is placed at the target pole and etched by argon ion bombardment. The etching rate is related to the sputtering yield of target materials, ion current density and vacuum degree of sputtering chamber. In sputtering etching, the sputtered target atoms should be removed from the sputtering chamber as far as possible. The common method is to introduce reactive gas to react with sputtered target atoms to produce volatile gas, which is discharged from the sputtering chamber through a vacuum system.
In addition, sputtering coating is a new surface treatment technology developed recently. Surface treatment technology can improve the physical, mechanical and chemical properties of materials, and sputtering coating has two distinct characteristics of "high speed and low temperature" compared with vacuum coating.
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