Vacuum evaporation film is an evaporation or sublimation of a large number of molecules or atoms in a vacuum of no less than 10-2 Pa. The evaporation material is heated to a constant temperature by means of resistance heating or electron beam and laser bombardment, so that the thermal vibration energy of molecules or atoms in the material exceeds the bound energy of the surface, and then a large number of molecules or atoms are evaporated or sublimated and deposited directly on the substrate. Film. Ion slurry plating is a kind of thin film which is deposited on the surface of the plated workpiece by escaping atoms or molecules from the target material by bombarding the cathode target with high reproach motion of positive ions produced by gas discharge under the action of electric field.
Vacuum evaporation coating is the most commonly used method of heating gallbladder. Its advantages are simple structure of heating source, low cost and easy operation. It is not suitable for refractory metals and high temperature resistant dielectric materials. Electron beam heating and laser heating can overcome the shortcomings of resistance heating. In electron beam heating, the focused electron beam is used to directly heat the bombarded material, and the kinetic energy of the electron beam is changed into heat energy to evaporate the material. Laser heating uses high-power laser as heating source, but because of the high cost of high-power laser, it can only be used in a few research laboratories at present.
Sputtering technology is different from vacuum evaporation technology. "Sputtering" refers to the phenomenon that charged particles bombard the surface of a body (target) to make solid atoms or molecules emit from the surface. Most of the emitted particles are in atomic state, often called jet atoms. Sputtering particles used for bombarding targets can be electrons, quotients or neutral particles, because ions are easy to accelerate in the electric field to obtain the required kinetic energy, so most of them use ions as bombarding particles. Sputtering process is based on glow discharge, that is, sputtering ions are all from gas discharge. Different sputtering technologies adopt different glow discharge modes. DC bipolar sputtering is based on DC glow discharge triode sputtering, which is supported by hot cathode. It is based on radio frequency glow discharge. Magnetron sputtering is based on glow discharge controlled by annular magnetic field.
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