Sputtering is one of the main techniques for preparing thin film materials. It uses ions produced by ion source to accelerate the accumulation in vacuum, and forms high-speed ion beam, bombards solid surface, and exchanges kinetic energy between ions and atoms on solid surface, so that atoms on solid surface leave solid surface and deposit on the base surface and are bombarded. The hit solid is the raw material for preparing sputtering deposited thin films, which is called sputtering target.
Appliction
Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc. They can also be used in the field of glass coating, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative products and other industries.
Classification
According to the shape, it can be divided into square target, circular target and abnormal target.
According to the composition, it can be divided into metal target, alloy target and ceramic compound target.
According to the application field, it can be divided into microelectronic target, magnetic recording target, CD-ROM target, precious metal target, thin film resistance target, conductive film target, surface modified target, optical mask target, decorative layer target, electrode target, packaging target and other target.
High-purity and even ultra-high-purity metal materials are the basis of producing high-purity sputtering target materials. Taking sputtering target materials for semiconductor chips as an example, if the impurity content of sputtering target materials is too high, the film formed can not meet the required electrical performance, and particles are easily formed on the wafer during sputtering process, resulting in short circuit or loss of the circuit. Bad, seriously affect the performance of the film.
